IXYS Semiconductor GmbH
🏢 View company profile →8Patents
5Active
8Granted
50Portfolio score
Filing activity: Dec 26, 1995 → Aug 31, 2021
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7030426B2 | Power semiconductor component in the planar technique | Electricity | 17 | Expired |
| US5699232A | Power semiconductor module having a plastic housing a metal/ceramic multilayer substrate and terminals in a soft encapsulation | Electricity | 14 | Expired |
| US6507108B1 | Power semiconductor module | Electricity | 5 | Expired |
| US8876996B2 | Method for the manufacture of double-sided metalized ceramic substrates | Electricity | 1 | Active |
| US9042103B2 | Power semiconductor module with asymmetrical lead spacing | Electricity | 1 | Active |
| US9210818B2 | Power semiconductor module with asymmetrical lead spacing | Electricity | 0 | Active |
| US11811180B2 | Electrical contact for semiconductor package | Electricity | 0 | Active |
| US9790130B2 | Method of joining metal-ceramic substrates to metal bodies | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.