Package device and manufacturing method thereof
US11812549B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2023 |
| Grant date | Nov 7, 2023 |
| Priority date | — |
| Expiry date | Jan 10, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4682
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A package device and a manufacturing method thereof are provided. The package device includes a redistribution layer. The redistribution layer includes a first dielectric layer, a conductive layer, and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer, wherein the redistribution layer has a test mark, the test mark includes a conductive pattern formed of the conductive layer, the conductive pattern includes a center portion and a plurality of extension portions, and the plurality of extension portions are respectively connected to the center portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.