Faraday shield and apparatus for treating substrate
US11817291B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 14, 2021 |
| Grant date | Nov 14, 2023 |
| Priority date | — |
| Expiry date | Apr 9, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32651
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The inventive concept relates to an apparatus for processing a substrate. In an embodiment, the apparatus for processing the substrate includes a plasma chamber, a coil electrode installed around the plasma chamber, and a Faraday shield provided between the coil electrode and the plasma chamber. The Faraday shield includes a cutout having a plurality of slots formed in a vertical direction along a periphery of the plasma chamber, an upper rim provided at the top of the cutout, and a lower rim provided at the bottom of the cutout. The upper rim and the lower rim have a thermal expansion reduction means configured to reduce a difference in thermal deformation between the upper and the lower rim and the cutout.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.