Method for processing substrate
US11817330B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2022 |
| Grant date | Nov 14, 2023 |
| Priority date | — |
| Expiry date | Jul 21, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68728
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for processing a substrate is provided. The method includes the following operations: placing a substrate over a first injector in a substrate processing apparatus, the substrate having a front surface and a back surface opposite to the front surface, and the front surface having a plurality of concentric regions; adjusting a temperature of each of the plurality of concentric regions by controlling at least one of a flow rate and a temperature associated with a fluid dispensing from the first injector; and rotating the substrate by a spin base disposed below the substrate, the substrate is rotated with respect to a center axis perpendicular to the front surface thereof when adjusting the temperature. The spin base includes a ring opening for rotating relative to the first injector, and the first injector is displaced from a projection of a center of the substrate from a top view perspective.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.