Common cooling solution for multiple packages
US11817436B2 · kind B2 · utility
0Cited by
5References
20Claims
0Family size
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Key dates
| Filing date | Jun 28, 2021 |
| Grant date | Nov 14, 2023 |
| Priority date | — |
| Expiry date | Jun 28, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/473
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for a common cooling solution for multiple packages of a common height, including: a first die package; a second die package having a same height as the first die package; and a cooling element thermally coupled to the first die package and the second die package by a planar surface of the cooling element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.