Element substrate, liquid discharge head, and manufacturing method of same
US11820142B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2022 |
| Grant date | Nov 21, 2023 |
| Priority date | — |
| Expiry date | May 17, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14185
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An element substrate used in a liquid discharge head that discharges liquid to a recording material includes a substrate, an energy generating element that generates energy used to discharge the liquid, circuit wiring that has an electrode portion for external electrical connection and that drives the energy generating element, and that is implemented on the substrate, a first protective film layer that has an opening portion for exposing the electrode portion and that covers the circuit wiring, an electroplating ground layer formed on the electrode portion, and an electroplated bump layer made of a metal material formed on the electroplating ground layer. A bent portion is formed in the first protective film layer by the first protective film layer covering a protruding portion that the circuit wiring has. A second protective film layer is formed on the first protective film layer and covers the bent portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.