Inventor · Kawasaki, JP

Junichiro Iri

41Patents
5h-index
59Co-inventors
72Inventor score

Filing activity: Jul 27, 2001 → Oct 25, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US7211526B2 Laser based splitting method, object to be split, and semiconductor element chip Electricity 29 Expired
US6799841B2 Ink jet recording head, ink jet recording apparatus using such ink jet recording head, and method for manufacturing ink jet recording head Performing Operations; Transporting 22 Expired
US6530650B2 Ink jet head substrate, ink jet head, method for manufacturing ink jet head substrate, method for manufacturing ink jet head, method for using ink jet head and ink jet recording apparatus Performing Operations; Transporting 13 Expired
US8108998B2 Laser cutting method Emerging Cross-Sectional Technologies 7 Active
US6752489B2 Liquid ejection head and method of manufacturing the liquid ejection head Performing Operations; Transporting 7 Expired
US6644790B2 Ink-jet head substrate, ink-jet head and ink-jet recording apparatus Performing Operations; Transporting 5 Expired
US6474792B2 Liquid discharge head, method for manufacturing liquid discharge head, head cartridge on which liquid discharge head is mounted, and liquid discharge apparatus Performing Operations; Transporting 4 Expired
US8093530B2 Laser cutting apparatus and laser cutting method Performing Operations; Transporting 3 Active
US9333749B2 Method for manufacturing liquid ejection head substrate Emerging Cross-Sectional Technologies 3 Active
US9832864B2 Circuit board and liquid ejection head Electricity 3 Active
US7171748B2 Method of manufacturing a liquid jet recording head Emerging Cross-Sectional Technologies 3 Expired
US7791001B2 Automatic focusing apparatus, laser processing apparatus, and laser cutting apparatus Performing Operations; Transporting 2 Active
US8162444B2 Printing head and manufacturing method of printing head Emerging Cross-Sectional Technologies 2 Active
US7807940B2 Laser processing apparatus and laser processing method Performing Operations; Transporting 1 Active
US7837820B2 Method for dicing wafer and process for manufacturing liquid-discharging head using the dicing method Emerging Cross-Sectional Technologies 0 Active
US11840092B2 Liquid ejection head Performing Operations; Transporting 0 Active
US12420556B2 Container and method of manufacturing same Performing Operations; Transporting 0 Active
US12304211B2 Liquid storage container and recording apparatus Performing Operations; Transporting 0 Active
US8316744B2 Dicing method, program for the dicing method, and storage medium for the dicing method Emerging Cross-Sectional Technologies 0 Active
US12023931B2 Liquid ejection head and manufacturing method thereof Performing Operations; Transporting 0 Active
US11820142B2 Element substrate, liquid discharge head, and manufacturing method of same Performing Operations; Transporting 0 Active
US12427769B2 Recording element substrate and method of manufacturing the same Performing Operations; Transporting 0 Active
US12246535B2 Liquid ejection head and production method for producing same Performing Operations; Transporting 0 Active
US11827025B2 Liquid storage container, method of manufacturing liquid storage container, and liquid ejecting apparatus Performing Operations; Transporting 0 Active
US12129090B2 Package and container Emerging Cross-Sectional Technologies 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.