Adhesive composition
US11820922B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2018 |
| Grant date | Nov 21, 2023 |
| Priority date | — |
| Expiry date | Nov 20, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2463/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy-based crash durable adhesive composition including: (I) a liquid resin system comprising: (a) at least one epoxy resin; and (b) at least one toughener; wherein the viscosity of the above liquid resin system is less than about 800 Pa s at a temperature of 15° C.; and wherein the viscosity of the above liquid resin system is greater than about 5 Pa-s at a temperature of 60° C.; (II) a solid material comprising: (c) at least one hydrophobic fumed silica, wherein the fumed silica is present in the adhesive composition at a concentration of greater than 5 weight percent; and (III) a curative material comprising: (d) at least one latent heat-activated curing agent; wherein the rheology of the epoxy-based crash durable adhesive composition is such that the adhesive composition is pumpable at a temperature of 15° C. or greater; and wherein the epoxy-based crash durable adhesive composition exhibits an increase in wash-off resistance; a process for making the above adhesive composition; and a process for bonding metal substrates together with the above adhesive composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.