Method for open-loop or closed-loop control of the temperature of a chuck for a wafer, temperature adjustment device, and wafer testing system
US11821941B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 21, 2020 |
| Grant date | Nov 21, 2023 |
| Priority date | — |
| Expiry date | Jul 21, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/687
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for open-loop or closed-loop control of the temperature of a chuck for a wafer includes detecting the position of a test device for testing a wafer and determining the spatial distances between the test device and a plurality of temperature measurement devices for measuring the temperature of the chuck or of a wafer supported or clamped by the chuck. The method proceeds by selecting at least one temperature measurement device from the plurality of temperature measurement devices as a reference temperature measurement device; and controlling the temperature of the chuck by open-loop or closed-loop control on the basis of the temperature(s) of the chuck or wafer as measured by the selected one or more reference temperature measurement devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.