Substrate inspection system and method of manufacturing semiconductor device using substrate inspection system
US11823961B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2020 |
| Grant date | Nov 21, 2023 |
| Priority date | — |
| Expiry date | Jul 18, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S3/2391
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A substrate inspection apparatus includes a light source unit, a pulsed beam matching unit, a substrate support unit, an incidence angle adjusting unit, and a detecting unit. The light source unit emits a first laser beam having a first wavelength and a second laser beam having a second wavelength. The pulsed beam matching unit matches the first laser beam and the second laser beam to superimpose a pulse of the first laser beam on a pulse of the second laser beam in time and space. The substrate support unit supports a substrate to be inspected. The incidence angle adjusting unit adjusts angles of incidence of the matched first laser beam and second laser beams to irradiate the first laser beam and the second laser beam on the substrate, and mixes the first laser beam and the second laser beam to generate an evanescent wave on the substrate. The evanescent wave generates scattered light due to a defect of the substrate. The detecting unit detects the scattered light generated due to the defect of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.