Patent · US Active

Chip package with substrate integrated waveguide and waveguide interface

US11824019B2 · kind B2 · utility

0Cited by

0References

24Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Tuncay ERDOEL · Unterhaching, DE
Walter Hartner · Munich, DE
Ulrich Moeller · Holzkirchen, DE
Bernhard Rieder · Regensburg, DE
Ernst Seler · Munich, DE
Maciej Wojnowski · Munich, DE

Key dates

Filing date	Jun 24, 2021
Grant date	Nov 21, 2023
Priority date	—
Expiry date	Dec 23, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01Q13/06
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A chip package includes a chip configured to generate and/or receive a signal; a laminate substrate including a substrate integrated waveguide (SIW) for carrying the signal, the substrate integrated waveguide including a chip-to-SIW transition structure configured to couple the signal between the SIW and the chip and a SIW-to-waveguide transition structure configured to couple the signal out of the SIW or into the SIW, wherein the SIW-to-waveguide transition structure includes a waveguide aperture; and a plurality of electrical interfaces arranged about a periphery of the waveguide aperture, the plurality of electrical interfaces configured to receive the signal from the SIW-to-waveguide transition structure and output the signal from the chip package or to couple the signal to the SIW-to-waveguide transition structure and into the chip package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.