Interconnect networks using microLED-based optical links
US11824590B2 · kind B2 · utility
1Cited by
2References
12Claims
0Family size
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Key dates
| Filing date | Apr 13, 2021 |
| Grant date | Nov 21, 2023 |
| Priority date | — |
| Expiry date | Apr 13, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/856
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Integrated circuit chips may be optically interconnected using microLEDs. Some interconnections may be vertically-launched parallel optical links. Some interconnections may be planar-launched parallel optical links.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.