Patent · US Active

Packaged transistor having die attach materials with channels and process of implementing the same

US11830810B2 · kind B2 · utility

1Cited by

10References

22Claims

0Family size

Assignee

Wolfspeed, Inc. · US

Inventors

Mitch Flowers · Durham, US
Erwin B. Cohen · Durham, US
Alexander Komposch · معلمی نژاد, US
Larry Wall · Evansville, US

Key dates

Filing date	Oct 30, 2020
Grant date	Nov 28, 2023
Priority date	—
Expiry date	Oct 30, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1423
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A package includes a circuit that includes at least one active area and at least one secondary device area, a support configured to support the circuit, and a die attach material. The circuit being mounted on the support using the die attach material and the die attach material including at least one channel configured to allow gases generated during curing of the die attach material to be released from the die attach material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.