Patent · US Active

Electronic device package

US11830848B2 · kind B2 · utility

0Cited by

4References

15Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Zhicheng Ding · Shanghai, CN
Bin Liu · Fishers, US
Yong She · Shanghai, CN
Hyoung Il Kim · Folsom, US

Key dates

Filing date	Dec 31, 2016
Grant date	Nov 28, 2023
Priority date	—
Expiry date	Oct 25, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19105
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Electronic device package technology is disclosed. An electronic device package in accordance with the present disclosure can include an electronic component, a redistribution layer, and an interposer electrically coupling the redistribution layer and the electronic component. The interposer can have interconnect interfaces on a top side electrically coupled to the electronic component and interconnect interfaces on a bottom side electrically coupled to the redistribution layer. A density of the interconnect interfaces on the top side can be greater than a density of the interconnect interfaces on the bottom side. Associated systems and methods are also disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.