Resin molding apparatus and method of manufacturing resin molded product
US11833722B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2021 |
| Grant date | Dec 5, 2023 |
| Priority date | — |
| Expiry date | Aug 29, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3406
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A resin molding apparatus includes: a first molding mold provided with a first member and a second member configured to move relative to the first member, and configured to form a cavity by the first member and the second member; a second molding mold configured to hold a substrate; and a mask member so as to be relatively immovable with respect to the first member, configured to make contact with a portion of the substrate when the first molding mold and the second molding mold are clamped, and formed with a flow portion through which a resin material existing in the cavity and pressurized by the second member is capable of flowing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.