TOWA CORPORATION
79Patents
44Active
79Granted
50Portfolio score
Filing activity: Apr 27, 1990 → Feb 11, 2022 · 21 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5435953A | Method of molding resin for sealing an electronic device | Electricity | 49 | Expired |
| US5834035A | Method of and apparatus for molding resin to seal electronic parts | Emerging Cross-Sectional Technologies | 49 | Expired |
| US6476507B1 | Resin sealing method and resin sealing apparatus | Electricity | 27 | Expired |
| USD750845S1 | Working glove | General | 26 | Active |
| US6358776B1 | Method of fabricating an electronic component and apparatus used therefor | Electricity | 24 | Expired |
| US8387167B2 | Method for forming resin surface, method for manufacturing article which forms recessed portions different in size randomly on surface thereof and article manufactured by the method, and method for manufacturing gloves and gloves manufactured by the method | Emerging Cross-Sectional Technologies | 23 | Active |
| US8863317B2 | Work glove | Human Necessities | 23 | Active |
| US6165232A | Method and apparatus for securely holding a substrate during dicing | Electricity | 22 | Expired |
| US5507633A | Resin molding apparatus for sealing an electronic device | Electricity | 22 | Expired |
| US6977188B2 | Resin encapsulation molding method of electronic part and resin encapsulation molding apparatus used therefor | Electricity | 21 | Expired |
| US5603879A | Method of molding resin to seal electronic parts using two evacuation steps | Emerging Cross-Sectional Technologies | 21 | Expired |
| US5753538A | Method of sealing electronic parts with molded resin and mold employed therefor | Electricity | 20 | Expired |
| US5031022A | Film carrier for mounting IC chips | Electricity | 18 | Expired |
| US7682853B2 | Transparent member, optical device using transparent member and method of manufacturing optical device | Electricity | 17 | Active |
| US5874324A | Method of sealing electronic component with molded resin | Electricity | 17 | Expired |
| US5363777A | Waste heat treatment apparatus | Emerging Cross-Sectional Technologies | 16 | Expired |
| US6346433B1 | Method of coating semiconductor wafer with resin and mold used therefor | Electricity | 14 | Expired |
| US6773247B1 | Die used for resin-sealing and molding an electronic component | Electricity | 14 | Expired |
| US6630374B2 | Resin sealing method and resin sealing apparatus | Electricity | 12 | Expired |
| USD829386S1 | Working gloves | General | 11 | Active |
| US7207868B2 | Cutting apparatus | Performing Operations; Transporting | 11 | Active |
| USD776364S1 | Working glove | General | 10 | Active |
| USD744699S1 | Working glove | General | 10 | Active |
| US5783220A | Resin sealing and molding apparatus for sealing electronic parts | Performing Operations; Transporting | 10 | Expired |
| US7056770B2 | Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material | Electricity | 9 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.