Preparation method of copper-based graphene composite with high thermal conductivity
US11834751B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2020 |
| Grant date | Dec 5, 2023 |
| Priority date | — |
| Expiry date | Feb 22, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A preparation method of a copper-based graphene composite with high thermal conductivity is provided. A new electrodeposited solution is used for direct current (DC) electrodeposition at a reasonable electrodeposition frequency, which fabricates a new copper-based graphene composite with high tensile strength and thermal conductivity. The copper-based graphene composite prepared by electrodeposition has high thermal conductivity of 390-1112 W/(m·k) and tensile strength of 300-450 MPa, which meets the requirements in the field of thermal conduction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.