Patent · US Active

Preparation method of copper-based graphene composite with high thermal conductivity

US11834751B2 · kind B2 · utility

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Key dates

Filing dateAug 3, 2020
Grant dateDec 5, 2023
Priority date
Expiry dateFeb 22, 2041

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC25D17/10
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A preparation method of a copper-based graphene composite with high thermal conductivity is provided. A new electrodeposited solution is used for direct current (DC) electrodeposition at a reasonable electrodeposition frequency, which fabricates a new copper-based graphene composite with high tensile strength and thermal conductivity. The copper-based graphene composite prepared by electrodeposition has high thermal conductivity of 390-1112 W/(m·k) and tensile strength of 300-450 MPa, which meets the requirements in the field of thermal conduction.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.