Patent · US Active

Flip-chip package with reduced underfill area

US11837476B2 · kind B2 · utility

1Cited by

11References

9Claims

0Family size

Assignee

Western Digital Technologies, Inc. · US

Inventors

Yazhou Zhang · Manhasset, US
Hope Chiu · Shanghai, CN
Jiandi Du · 东关南街, CN
Paul Qu · Shanghai, CN

Key dates

Filing date	May 15, 2020
Grant date	Dec 5, 2023
Priority date	—
Expiry date	May 18, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A flip-chip package and a method for assembling a flip-chip package includes positioning the die on a substrate and introducing an underfill material into a space between the die and the substrate, where a portion of the underfill material extends beyond an edge of the die and forms a fillet that at least partially surrounds the die. The underfill material is cured, and a portion of the fillet is removed to reduce the area of the fillet.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.