Paul Qu
4Patents
1h-index
17Co-inventors
34Inventor score
Filing activity: May 15, 2020 → May 13, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11837476B2 | Flip-chip package with reduced underfill area | Electricity | 1 | Active |
| US12114435B2 | Surface mount technology method and magnetic carrier system | Electricity | 0 | Active |
| US12021060B2 | Reducing keep-out-zone area for a semiconductor device | Electricity | 0 | Active |
| US12021061B2 | Packaged memory device with flip chip and wire bond dies | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.