Patent · US Active

Robot arm device and method for transferring wafer

US11837484B2 · kind B2 · utility

0Cited by

8References

20Claims

0Family size

Assignee

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. · TW

Inventors

Wei-Hua Houng · Hsinchu, TW
Che-Fu Chen · Hsinchu, TW

Key dates

Filing date	Apr 12, 2021
Grant date	Dec 5, 2023
Priority date	—
Expiry date	Jul 10, 2041

Classification

Technology area (CPC G)Physics
CPC primaryG01N2291/2697
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A method includes positioning an end effector at a height lower than a height of a wafer. The end effector is moved to a position under the wafer. A wafer backside property of the wafer is detected by using a sensor on the end effector. The wafer backside property is analyzed to obtain an analysis result.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.