Manufacturing method of light emitting diode package structure
US11837591B2 · kind B2 · utility
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17Claims
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Key dates
| Filing date | Apr 5, 2022 |
| Grant date | Dec 5, 2023 |
| Priority date | — |
| Expiry date | Apr 5, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/854
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of a light emitting diode (LED) package structure includes the following steps. A carrier is provided. A redistribution layer is formed on the carrier. A plurality of active devices are formed on the carrier. A plurality of LEDs are transferred on the redistribution layer. The LEDs and the active devices are respectively electrically connected to the redistribution layer. The active devices are adapted to drive the LEDs, respectively. A molding compound is formed on the redistribution layer to encapsulate the LEDs. The carrier is removed to expose a bottom surface of the redistribution layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.