Electronic device with conductive via structures
US11839120B2 · kind B2 · utility
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1References
12Claims
0Family size
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Key dates
| Filing date | Sep 30, 2020 |
| Grant date | Dec 5, 2023 |
| Priority date | — |
| Expiry date | May 10, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/122
Abstract
An electronic device including a pixel array structure, a redistribution structure, and a plurality of conductive via structures is provided. The pixel array structure includes a plurality of signal lines. The redistribution structure overlaps the pixel array structure and includes a plurality of conductive lines. The conductive via structures electrically connect the signal lines of the pixel array structure and the conductive lines of the redistribution structure. At least one of the conductive via structures shares at least one conductive layer with the pixel array structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.