Chieh-Wei Feng
12Patents
1h-index
22Co-inventors
46Inventor score
Filing activity: Aug 24, 2014 → Mar 30, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10950588B2 | Chip package structure and manufacturing method thereof | Electricity | 1 | Active |
| US10786719B2 | Swimming posture correction method and swimming posture correction system | Physics | 1 | Active |
| US10418435B2 | Pixel structure and display panel | Electricity | 1 | Active |
| US9960245B1 | Transistor device having protruding portion from channel portion | Electricity | 0 | Active |
| US9397220B2 | Thin film transistor | Electricity | 0 | Active |
| US10941498B2 | Panel to be plated, electroplating process using the same, and chip manufactured from the same | Electricity | 0 | Active |
| US11251115B1 | Redistribution structure and forming method thereof | Electricity | 0 | Active |
| US11776920B2 | Capacitor and filter and redistribution layer structure including the same | Electricity | 0 | Active |
| US11387230B2 | System in package structure for perform electrostatic discharge operation and electrostatic discharge protection structure thereof | Electricity | 0 | Active |
| US11088135B2 | Electrostatic discharge protection apparatus and integrated passive device with capacitors | Electricity | 0 | Active |
| US11764166B2 | Semiconductor package structure | Electricity | 0 | Active |
| US11839120B2 | Electronic device with conductive via structures | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.