Cooler device with aluminum oxide insulators
US11839165B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2023 |
| Grant date | Dec 5, 2023 |
| Priority date | — |
| Expiry date | Feb 1, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B30/00
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A solid state cooler device is disclosed that comprises a first normal metal pad, a first aluminum layer and a second aluminum layer disposed on the first normal metal pad and separated from one another by a gap, a first aluminum oxide layer formed on the first aluminum layer, and a second aluminum oxide layer formed on the second aluminum layer, and a first superconductor pad disposed on the first aluminum oxide layer and a second superconductor pad disposed on the second aluminum oxide layer. The device further comprises a first conductive pad coupled to the first superconductor pad, and a second conductive pad coupled to the second superconductor pad, wherein hot electrons are removed from the first normal metal pad when a bias voltage is applied between the first conductive pad and the second conductive pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.