Resin composition and article made therefrom
US11840628B2 · kind B2 · utility
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13Claims
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Assignee
Inventors
Key dates
| Filing date | Oct 8, 2021 |
| Grant date | Dec 12, 2023 |
| Priority date | — |
| Expiry date | Dec 12, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/03
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin; 15 parts by weight to 40 parts by weight of a hydrogenated styrene-butadiene-styrene triblock copolymer; 1 part by weight to 20 parts by weight of a compound of Formula (1); and 0.001 part by weight to 0.5 part by weight of a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.