Wire bonding system including a wire biasing tool
US11842978B1 · kind B1 · utility
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13References
10Claims
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Assignee
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Key dates
| Filing date | Jul 15, 2022 |
| Grant date | Dec 12, 2023 |
| Priority date | — |
| Expiry date | Jul 15, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K20/004
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wire bonding system has a bonding tool and a wire guide for guiding a bonding wire to a tip of the bonding tool for conducting wire bonding operations. A wire biasing tool is located adjacent to the wire guide, and a rotary actuator is operatively connected to the wire biasing tool by a linkage mechanism. The rotary actuator is operable to move the wire biasing tool along a predetermined travel path to apply a biasing force onto a length of bonding wire extending from the tip of the bonding tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.