Patent · US Active

Method for producing an electronic component, wherein a semiconductor chip is positioned and placed on a connection carrier, corresponding electronic component, and corresponding semiconductor chip and method for producing a semiconductor chip

US11842980B2 · kind B2 · utility

0Cited by

7References

19Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Mathias Wendt · Eschborn, DE
Simeon Katz · Regensburg, DE
Pascal Porten · Regensburg, DE

Key dates

Filing date	Oct 17, 2019
Grant date	Dec 12, 2023
Priority date	—
Expiry date	Jan 27, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/857
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The method of producing an electronic component (100) comprises a step A) of providing a semiconductor chip (2) having an underside (20), having a plurality of contact pins (21), and having at least one positioning pin (25) protruding from the underside. The contact pins are adapted to electrically contact the semiconductor chip. The positioning pin narrows in the direction away from the underside and protrudes further from the underside than the contact pins. The semiconductor chip is placed on the connection carrier, with the contact pins each being inserted into a contact recess and the positioning pin being inserted into the positioning recess. The contact pins are immersed in the molten solder material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.