Polishing pad employing polyamine and cyclohexanedimethanol curatives
US11845156B2 · kind B2 · utility
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Key dates
| Filing date | Jul 8, 2020 |
| Grant date | Dec 19, 2023 |
| Priority date | — |
| Expiry date | Feb 4, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2110/0058
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A chemical-mechanical polishing pad comprising a thermosetting polyurethane polishing layer includes an isocyanate-terminated urethane prepolymer, a polyamine curative, and a cyclohexanedimethanol curative. The polyamine curative and the cyclohexanedimethanol curative are in a molar ratio of polyamine curative to cyclohexanedimethanol curative in a range from about 20:1 to about 1:1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.