Chemical mechanical planarization pads via vat-based production
US11845157B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | May 7, 2020 |
| Grant date | Dec 19, 2023 |
| Priority date | — |
| Expiry date | Oct 6, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L75/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polishing (CMP) pad includes a polishing portion formed using a vat-based additive manufacturing process. The polishing portion includes a polymer material with a first elastic modulus. In some embodiments the polishing portion is disposed on the backing portion. The backing portion may have a second elastic modulus. The second elastic modulus may be less than the first elastic modulus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.