Manufacturing method of fingerprint sensor
US11847852B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2022 |
| Grant date | Dec 19, 2023 |
| Priority date | — |
| Expiry date | Dec 22, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/70
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A fingerprint sensor includes a die, a plurality of conductive structures, an encapsulant, a plurality of conductive patterns, a first dielectric layer, a second dielectric layer, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The conductive structures surround the die. The encapsulant encapsulates the die and the conductive structures. The conductive patterns are over the die and are electrically connected to the die and the conductive structures. Top surfaces of the conductive patterns are flat. The first dielectric layer is over the die and the encapsulant. A top surface of the first dielectric layer is coplanar with top surfaces of the conductive patterns. The second dielectric layer covers the first dielectric layer and the conductive patterns. The redistribution structure is over the rear surface of the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.