Multi-plate electrostatic chucks with ceramic baseplates
US11848177B2 · kind B2 · utility
2Cited by
3References
45Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2018 |
| Grant date | Dec 19, 2023 |
| Priority date | — |
| Expiry date | Jul 7, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68742
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck for a substrate processing system is provided. The electrostatic chuck includes: a top plate configured to electrostatically clamp to a substrate and formed of ceramic; an intermediate layer disposed below the top plate; and a baseplate disposed below the intermediate layer and formed of ceramic. The intermediate layer bonds the top plate to the baseplate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.