Micro-electro mechanical system and manufacturing method thereof
US11851321B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Mar 1, 2021 |
| Grant date | Dec 26, 2023 |
| Priority date | — |
| Expiry date | Jul 31, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0735
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A micro electro mechanical system (MEMS) includes a circuit substrate comprising electronic circuitry, a support substrate having a recess, a bonding layer disposed between the circuit substrate and the support substrate, through holes passing through the circuit substrate to the recess, a first conductive layer disposed on a front side of the circuit substrate, and a second conductive layer disposed on an inner wall of the recess. The first conductive layer extends into the through holes and the second conductive layer extends into the through holes and coupled to the first conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.