Inventor · Tainan, TW

Ting-Li Yang

19Patents
2h-index
30Co-inventors
46Inventor score

Filing activity: Aug 21, 2015 → Dec 1, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US11855017B2 Semiconductor device and method Electricity 3 Active
US9586281B2 Forming a solder joint between metal layers Emerging Cross-Sectional Technologies 2 Active
US11908790B2 Chip structure with conductive via structure and method for forming the same Electricity 2 Active
US11955423B2 Semiconductor device and method Electricity 2 Active
US10269703B2 Semiconductor device and method of forming the same Electricity 1 Active
US11855028B2 Hybrid micro-bump integration with redistribution layer Electricity 1 Active
US11557508B2 Semiconductor device structure having protection caps on conductive lines Electricity 0 Active
US10252363B2 Forming a solder joint between metal layers Emerging Cross-Sectional Technologies 0 Active
US11862588B2 Semiconductor device and method Electricity 0 Active
US12412857B2 Hybrid micro-bump integration with redistribution layer Electricity 0 Active
US10748810B2 Method of manufacturing an integrated inductor with protections caps on conductive lines Electricity 0 Active
US12368120B2 Semiconductor device and method Electricity 0 Active
US12347722B2 Semiconductor device structure with a protection cap at an end portion of a conductive line Electricity 0 Active
US11901266B2 Semiconductor device structure and method for forming the same Electricity 0 Active
US11942398B2 Semiconductor device having at least one via including concave portions on sidewall Electricity 0 Active
US12057423B2 Bump integration with redistribution layer Electricity 0 Active
US11851321B2 Micro-electro mechanical system and manufacturing method thereof Performing Operations; Transporting 0 Active
US12243837B2 Semiconductor device and method Electricity 0 Active
US12266593B2 Method of forming semiconductor device having at least one via including concave portions on sidewall Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.