Methods and systems for detecting defects on an electronic assembly
US11852684B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2023 |
| Grant date | Dec 26, 2023 |
| Priority date | — |
| Expiry date | Mar 31, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/20
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of identifying defects in an electronic assembly, comprising, by a processing unit, obtaining a grid of nodes representative of a location of electronic units of an electronic assembly, wherein each node is neighboured by at most eight other nodes, wherein a first plurality of nodes represents failed electronic units according to at least one test criterion, and a second plurality of nodes represents passing electronic units according to the least one first test criterion, based on the grid, determining at least one first and second straight lines, and attempting to connect the first and second straight lines into a new line, wherein if at least one node from the new line belongs to the second plurality of nodes, concluding that an electronic unit represented by the node on the grid is a failed electronic unit, thereby facilitating identification of a failed electronic unit on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.