Semiconductor cleaning equipment and method for cleaning through vias using the same
US11854794B2 · kind B2 · utility
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12Claims
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Assignee
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Key dates
| Filing date | Dec 18, 2018 |
| Grant date | Dec 26, 2023 |
| Priority date | — |
| Expiry date | Jun 2, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76814
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for cleaning a through via including the following steps is provided: heating a cleaning fluid to a predetermined temperature; mixing the cleaning liquid with an inert gas and entering into a cleaning cavity; atomizing the cleaning liquid in an atomizer to spray on a wafer surface and to wet an inner wall and a bottom of the through via; and closing a cleaning liquid valve.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.