Semicondutor package substrate with die cavity and redistribution layer
US11854922B2 · kind B2 · utility
0Cited by
9References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2021 |
| Grant date | Dec 26, 2023 |
| Priority date | — |
| Expiry date | Jul 5, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19104
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a semiconductor substrate forming a cavity and a redistribution layer on a first side of the semiconductor substrate, the redistribution layer forming die contacts within the cavity and a set of terminals for the semiconductor package opposite the semiconductor substrate. The redistribution layer electrically connects one or more of the die contacts to the set of terminals. The semiconductor package further includes a semiconductor die including die terminals within the cavity with the die terminals electrically coupled to the die contacts within the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.