Patent · US Active

Substrate pattern filling composition and use of the same

US11859152B2 · kind B2 · utility

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0References

20Claims

0Family size

Assignee

Merck Patent GmbH · DE

Inventors

Yuko HORIBA · Kakegawa, JP
Hiroko Kuboki · Kakegawa, JP
Tatsuro Nagahara · Kakegawa, JP

Key dates

Filing date	Apr 15, 2020
Grant date	Jan 2, 2024
Priority date	—
Expiry date	Oct 21, 2040

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC11D2111/22
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

To provide a substrate pattern filling composition capable of suppressing pattern collapse and a method for using the same. A substrate pattern filling composition comprising a first solute (A), a second a solute (B) and a solvent (C), and a method for using the same.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.