Plating apparatus

US11859303B2 · kind B2 · utility

Assignee

• ACM RESEARCH (SHANGHAI), INC. · CN

Inventors

• Zhaowei Jia · Shanghai, CN
• Hongchao Yang · Shanghai, CN
• Chenhua Lu · Shanghai, CN
• Jian Wang · Rosharon, US
• Hui Wang · Shanghai, CN

Key dates

• Filing date: Aug 30, 2017
• Grant date: Jan 2, 2024
• Expiry date: Jan 15, 2038

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D17/02
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A plating apparatus for depositing metal on a substrate, comprising a membrane frame (14), a catholyte inlet pipe (30) and a center cap (40). The membrane frame (14) has a center passage (144) which passes through the center of the membrane frame (14). The catholyte inlet pipe (30) is connected to the center passage (144) of the membrane frame (14). The center cap (40) is fixed at the center of the membrane frame (14) and covers over the center passage (144) of the membrane frame (14). The top of the center cap (40) has a plurality of first holes (42). The catholyte inlet pipe (30) supplies catholyte to the center cap (40) through the center passage (144) of the membrane frame (14), and the catholyte is supplied to a center area of the substrate through the first holes (42) of the center cap (40).