Substrate liquid processing apparatus, substrate liquid processing method and recording medium
US11862486B2 · kind B2 · utility
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5Claims
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Key dates
| Filing date | Aug 5, 2020 |
| Grant date | Jan 2, 2024 |
| Priority date | — |
| Expiry date | Jul 29, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68764
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus includes a substrate holding unit 31 configured to hold a substrate W; an outer nozzle 45 configured to discharge a processing liquid toward a surface of the substrate from a position at an outside of an outer edge of the substrate held by the substrate holding unit such that at least a central portion of the surface of the substrate is covered with a liquid film of the discharged processing liquid; and an actuator 46 (90) configured to change a height position or a discharge angle of the outer nozzle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.