Selectable monolithic or external scalable die-to-die interconnection system methodology

US11862557B2 · kind B2 · utility

Assignee

• Apple Inc. · US

Inventors

• Sanjay Dabral · Palo Alto, US
• Jun Zhai · Cupertino, US
• Jung-Cheng Yeh · San Jose, US
• Kunzhong Hu · Cupertino, US
• Raymundo M. Camenforte · San Jose, US
• Thomas Hoffmann · Münstermaifeld, DE

Key dates

• Filing date: Sep 23, 2021
• Grant date: Jan 2, 2024
• Expiry date: Dec 22, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2225/06586
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Multi-die structures and methods of fabrication are described. In an embodiment, a multi-die structure includes a first die, a second die, and die-to-die routing connecting the first die to the second die. The die-to-die interconnection may be monolithically integrated as a chip-level die-to-die routing, or external package-level die-to-die routing.