Inventor · Cupertino, CA, US

Jun Zhai

97Patents
11h-index
92Co-inventors
81Inventor score

Filing activity: Sep 3, 2004 → Oct 17, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US9559081B1 Independent 3D stacking Electricity 221 Active
US9633974B2 System in package fan out stacking architecture and process flow Electricity 39 Active
US9661411B1 Integrated MEMS microphone and vibration sensor Electricity 28 Active
US9583472B2 Fan out system in package and method for forming the same Electricity 19 Active
US9589936B2 3D integration of fanout wafer level packages Electricity 18 Active
US9935087B2 Three layer stack structure Electricity 16 Active
US9679801B2 Dual molded stack TSV package Electricity 15 Active
US9601471B2 Three layer stack structure Electricity 15 Active
US9595514B2 Package with SoC and integrated memory Electricity 14 Active
US9659907B2 Double side mounting memory integration in thin low warpage fanout package Electricity 14 Active
US9548288B1 Integrated circuit die decoupling system with reduced inductance Electricity 11 Active
US7253504B1 Integrated circuit package and method Electricity 10 Expired
US10943869B2 High density interconnection using fanout interposer chiplet Electricity 10 Active
US9883822B2 Biometric sensor chip having distributed sensor and control circuitry Human Necessities 10 Active
US9935076B1 Structure and method for fabricating a computing system with an integrated voltage regulator module Electricity 9 Active
US7745264B2 Semiconductor chip with stratified underfill Electricity 8 Active
US10985107B2 Systems and methods for forming die sets with die-to-die routing and metallic seals Electricity 8 Active
US9305959B2 Biometric sensor chip having distributed sensor and control circuitry Electricity 8 Active
US7679200B2 Semiconductor chip with crack stop Electricity 8 Active
US8963311B2 PoP structure with electrically insulating material between packages Emerging Cross-Sectional Technologies 7 Active
US11561144B1 Wearable electronic device with fluid-based pressure sensing Physics 7 Active
US9331058B2 Package with SoC and integrated memory Electricity 6 Active
US11309246B2 High density 3D interconnect configuration Electricity 6 Active
US9236355B2 EMI shielded wafer level fan-out pop package Electricity 5 Active
US7989956B1 Interconnects with improved electromigration reliability Electricity 4 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.