Semiconductor device having a crack detection ring and a crack detection structure
US11862575B2 · kind B2 · utility
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5References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 2, 2021 |
| Grant date | Jan 2, 2024 |
| Priority date | — |
| Expiry date | Nov 18, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/585
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a crack detection ring and a crack detection structure. The semiconductor device comprises a first seal-ring surrounding a circuit region; a crack detection ring surrounding the first seal-ring; a second seal-ring surrounding the first seal-ring and the crack detection ring; a connection part connecting the first seal-ring and the crack detection ring; and a crack detection structure disposed in the circuit region and electrically connected to the crack detection ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.