Integrated module assembly for optical integrated circuits
US11862749B2 · kind B2 · utility
0Cited by
7References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 2, 2020 |
| Grant date | Jan 2, 2024 |
| Priority date | — |
| Expiry date | Dec 2, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/933
Abstract
An integrated module assembly can include: an optical integrated circuit having first and second optical devices; a PCB having first and second holes therein, where the optical integrated circuit is coupled upside down to a first side of the PCB; and first and second lenses coupled to a second side of the PCB, where the first and second sides of the PCB are opposite thereto; and where the first lens is in alignment with the first hole and the first optical device, and the second lens is in alignment with the second hole and the second optical device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.