Electronic package
US11862757B2 · kind B2 · utility
0Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2021 |
| Grant date | Jan 2, 2024 |
| Priority date | — |
| Expiry date | Sep 24, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/01
Abstract
The present description concerns a package for an electronic device. The package including a plate and a lateral wall, separated by a layer made of a bonding material and at least one region made of a material configured to form in the region an opening between the inside and the outside of the package when the package is heated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.