Chassis as a common cooling solution for die packages
US11864344B2 · kind B2 · utility
0Cited by
2References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 27, 2021 |
| Grant date | Jan 2, 2024 |
| Priority date | — |
| Expiry date | Sep 27, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A computing device chassis for a common cooling solution for die packages comprising: a chassis base comprising: an internal cavity; a cooling element housed in the internal cavity; and one or more thermal interfaces to the cooling element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.