Heat conduction apparatus and terminal device
US11864350B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2020 |
| Grant date | Jan 2, 2024 |
| Priority date | — |
| Expiry date | Jul 23, 2040 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D2021/0029
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat conduction apparatus includes a first cover plate and a second cover plate. The first cover plate is hermetically connected to the second cover plate. The first cover plate is provided with a plurality of grooves. A supporting portion is formed between two adjacent grooves. A liquid circulation channel and a vapor circulation channel are formed in the groove. The liquid circulation channel is filled with a liquid working medium. The liquid circulation channel is communicated with the vapor circulation channel. The liquid working medium vaporizes into vapor. The vapor enters the vapor circulation channel and condenses into liquid. The liquid enters the liquid circulation channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.