Yongfu Sun
8Patents
1h-index
17Co-inventors
40Inventor score
Filing activity: Nov 28, 2018 → Feb 28, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11284537B2 | Heat-conducting assembly and terminal | Electricity | 2 | Active |
| US12432280B2 | Method and apparatus for establishing network connection, electronic device, and storage medium | Electricity | 0 | Active |
| US11864350B2 | Heat conduction apparatus and terminal device | Mechanical Engineering; Lighting; Heating | 0 | Active |
| US10713135B2 | Data disaster recovery method, device and system | Physics | 0 | Active |
| US12405647B2 | Mobile terminal and middle frame assembly | Electricity | 0 | Active |
| US12336146B2 | Temperature equalization component and electronic device | Physics | 0 | Active |
| US12417149B2 | Service cluster instance backup and recovery methods and related devices | Physics | 0 | Active |
| US11839055B2 | Heat-conducting assembly and terminal | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.