Method for manufacturing electroless plating substrate and method for forming metal layer on surface of substrate
US11865518B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2020 |
| Grant date | Jan 9, 2024 |
| Priority date | — |
| Expiry date | May 16, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/34
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The instant disclosure provides a method for manufacturing an electroless plating substrate and a method for forming a metal layer on a surface of a substrate. The method for preparing the electroless plating substrate includes: providing a substrate; attaching a self-adsorbed catalyst composition to a surface of the substrate; and performing an electroless metal deposition for forming an electroless metal layer on the surface of the substrate. The self-adsorbed catalyst composition includes a colloidal nanoparticle and a silane compound. The colloidal nanoparticle includes a palladium nanoparticle and a capping agent enclosing the palladium nanoparticle. The silane compound has at least one amino group to interact with the colloidal nanoparticle. A covalent bond between the silane compound and the surface of the substrate is formed through the at least one silane group of the silane compound. The colloid nanoparticle has a particle size ranging from 5 to 10 nanometers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.