Polyphenylene ether resin composition, prepreg using same, film with resin, metal foil with resin, metal-clad laminate and wiring board
US11866580B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Oct 16, 2018 |
| Grant date | Jan 9, 2024 |
| Priority date | — |
| Expiry date | Jun 9, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2312/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
One aspect of the present application relates to a polyphenylene ether resin composition including a modified polyphenylene ether compound (A) that is terminally modified with a substituent having a carbon-carbon unsaturated double bond, and a crosslinking-type curing agent (B) having two or more carbon-carbon unsaturated double bonds in each molecule, the modified polyphenylene ether compound (A) including a modified polyphenylene ether compound (A-1) having a specific structure, and a modified polyphenylene ether compound (A-2) having a specific structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.