Pressure-sensitive adhesive compound containing a cross-linked nanoparticle network, method of production and use thereof

US11866614B2 · kind B2 · utility

Assignee

• tesa SE · DE

Inventors

• Klaus Keite-Telgenbüscher · Hamburg, DE
• Christian Schuh · Hamburg, DE
• Bernd Lühmann · Norderstedt, DE
• Thilo Dollase · Hamburg, DE
• Minyoung Bai · Hamburg, DE
• Thorsten Krawinkel · Hamburg, DE

Key dates

• Filing date: Sep 10, 2021
• Grant date: Jan 9, 2024
• Expiry date: Oct 5, 2041

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/287
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

A structural adhesive bond formed with a pressure-sensitive adhesive that comprises at least two components forming one phase each, from which an interpenetrating network with at least two phases is produced by a cross-linking build-up reaction, the first phase and second phase having at least a softening point temperature of less than 23° C. and greater than 23° C., respectively, the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.